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DIN, the First Modular AI-Native Data Pre-Processing Layer, closes $4M Pre-Listing Round


Modular AI-Native Data Pre-Processing Layer

August 20, 2024


DIN, the first modular AI-native data pre-processing layer, has completed a $4 million pre-listing funding round, raising its total funding to $8 million. Capitalizing on this progress, DIN launched the Chipper Node Sale on August 13, marking a significant step in its goal to influence the decentralized AI data economy.


Project

Latest Raise

Latest Raise Date

Stage

Total Raise

Category

DIN

$4M

August 20, 2024

Pre-Listing Round

$8M

AI

To advance its goal of enabling everyone to process data for AI and earn rewards, DIN is using its robust financial support to introduce new community engagement opportunities. After the successful fundraising, DIN is now concentrating on growing its ecosystem with the DIN Chipper Node sale, offering early access and encouraging global participation in the AI data economy.


About DIN

DIN is a platform designed to help people process data for AI and earn rewards. It offers a modular AI-native data pre-processing layer, allowing users to contribute to the AI data economy. The platform aims to empower users by providing tools and opportunities for community involvement, ensuring sustainable yield and enhancing the utility of AI data processing.


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Modular AI-Native Data Pre-Processing Layer

 

 

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